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BRC2012T2R2MD - TAIYO YUDEN

Description: BRC2012T2R2MD

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Symbol
BRC2012T2R2MD - TAIYO YUDEN - PCB symbol
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PCB Footprints
BRC2012T2R2MD - TAIYO YUDEN PCB footprint - Inductors Chip - Inductors Chip - BRC2012
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3D Models
BRC2012T2R2MD - TAIYO YUDEN - 3D model - Inductors Chip - BRC2012
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BRC2012T2R2MD Details

  • Manufacturer Part Number:

    BRC2012T2R2MD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    TAIYO YUDEN

  • YTEOL:

    8

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.143 Ω

  • Inductance-Nom (L):

    2.2 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.4 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Current-Max:

    1 A

  • Self Resonance Frequency:

    350 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    DCR MEASURED AT 30% TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

BRC2012T2R2MD Frequently Asked Questions (FAQs)

  • The recommended land pattern for the BRC2012T2R2MD is a rectangular pad with a size of 1.2mm x 0.8mm, with a solder mask opening of 0.8mm x 0.5mm.
  • The BRC2012T2R2MD has a thermal resistance of 30°C/W. To handle thermal considerations, ensure good airflow around the component, use a thermal pad or heat sink if necessary, and avoid overheating the component.
  • The maximum operating temperature for the BRC2012T2R2MD is 125°C, with a storage temperature range of -40°C to 150°C.
  • To ensure reliability in high-vibration environments, use a secure mounting method, such as soldering or adhesive, and consider using a vibration-dampening material or potting compound to reduce stress on the component.
  • The recommended reflow soldering profile for the BRC2012T2R2MD is a peak temperature of 260°C, with a ramp-up rate of 3°C/s, a dwell time of 30-60 seconds, and a cool-down rate of 6°C/s.

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BRC2012T2R2MD Overview

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General Purpose Inductor, 2.2uH, 20%, 1 Element, Ferrite-Core, SMD, 0805