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BRD1267C-TL - Power Integrations

Description: Half Bridge Driver DC Motors, General Purpose Power MOSFET 400W, 600V, 11.5A, InSOP-24C

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PCB Footprints
BRD1267C-TL - Power Integrations PCB footprint - Other - Other - InSOP-24C_ 2023
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BRD1267C-TL Details

  • Manufacturer Part Number:

    BRD1267C-TL

  • Part Life Cycle Code:

    Active

  • Package Description:

    INSOP-24/20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Power Integrations

  • YTEOL:

    8

  • Analog IC - Other Type:

    HALF BRIDGE BRUSH DC MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    10.8 mm

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Current-Max:

    11.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSSOP

  • Package Equivalence Code:

    SOP20/24,.54,30

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.45 mm

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.75 mm

  • Terminal Position:

    DUAL

  • Width:

    9.4 mm

BRD1267C-TL Frequently Asked Questions (FAQs)

  • Power Integrations provides a recommended PCB layout in their application notes (e.g., AN-63) and evaluation board documentation. Key considerations include keeping the high-current paths short, using a solid ground plane, and minimizing loop areas.
  • Implement a soft-start circuit to limit inrush current and ensure a controlled startup. For shutdown, use a controlled shutdown sequence to prevent voltage spikes and ensure a safe shutdown. Refer to Power Integrations' application notes for guidance.
  • The device has a high power density, so thermal management is crucial. Ensure good airflow, use a heat sink if necessary, and follow Power Integrations' thermal design guidelines. Monitor the junction temperature (TJ) and adjust the design accordingly.
  • Use a combination of capacitors and inductors to filter the output. Choose components with low equivalent series resistance (ESR) and inductance. Optimize the filter design using simulation tools and follow Power Integrations' guidelines for output filter design.
  • Follow Power Integrations' EMI and EMC guidelines, including using a shielded layout, minimizing loop areas, and using EMI filters. Ensure compliance with relevant regulatory standards (e.g., CISPR, FCC).

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