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BSC009NE2LS5ATMA1 - Infineon

Description: MOSFET LV POWER MOS

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PCB Footprints
BSC009NE2LS5ATMA1 - Infineon PCB footprint - Other - Other - PG-TDSON-8-5
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BSC009NE2LS5ATMA1 - Infineon  - 3D model - Other - PG-TDSON-8-5
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BSC009NE2LS5ATMA1 Details

  • Manufacturer Part Number:

    BSC009NE2LS5ATMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    90 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    223 A

  • Drain-source On Resistance-Max:

    0.00125 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    130 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    74 W

  • Pulsed Drain Current-Max (IDM):

    892 A

  • Reference Standard:

    IEC-68-1; IEC-61249-2-21

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC009NE2LS5ATMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal pad design, copper thickness, and via placement to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider using a heat sink or cooling system. Additionally, ensure that the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.
  • The BSC009NE2LS5ATMA1 has built-in ESD protection, but it's still essential to follow proper ESD handling and storage procedures to prevent damage. Infineon recommends following the ESD Association's standard for ESD control, ANSI/ESD S20.20.
  • Yes, the BSC009NE2LS5ATMA1 is AEC-Q101 qualified, making it suitable for automotive applications. However, it's essential to ensure that the device is used within the specified operating conditions and that the system design meets the required automotive standards.
  • Infineon recommends following the soldering conditions outlined in their application note AN2013-01, which includes guidelines for reflow soldering, wave soldering, and hand soldering to ensure reliable assembly.

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