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BSC014NE2LSI - Infineon

Description: MOSFET N-Ch 25V 100A TDSON-8 OptiMOS

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PCB Footprints
BSC014NE2LSI - Infineon PCB footprint - Other - Other - PG-TDSON-8_1.2h
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3D Models
BSC014NE2LSI - Infineon  - 3D model - Other - PG-TDSON-8_1.2h
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BSC014NE2LSI Details

  • Manufacturer Part Number:

    BSC014NE2LSI

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    GREEN, PLASTIC, TDSON-8

  • Pin Count:

    8

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    50 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    33 A

  • Drain-source On Resistance-Max:

    0.002 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    74 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC014NE2LSI Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider using a thermal sensor to monitor the device temperature.
  • The maximum allowed voltage on the input pins is 5.5V, exceeding this may cause damage to the device. Ensure that the input voltage is within the recommended operating range.
  • Infineon recommends using ESD protection devices, such as TVS diodes, on the input lines to protect the device from electrostatic discharge. Follow the recommended ESD protection circuitry guidelines.
  • The recommended storage temperature range for BSC014NE2LSI is -40°C to 125°C. Storing the device outside this range may affect its reliability and performance.

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