Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Ensure proper thermal management, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer between the device and heat sink.
Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 60-90 seconds, and a cooling rate of 4-6°C/s. Refer to the Infineon soldering guide for more details.
Store the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Avoid bending, flexing, or applying excessive pressure to the package.
Handle the device by the package body, avoiding touching the pins or electrical connections. Clean the device with a soft brush and mild soap solution, avoiding harsh chemicals or ultrasonic cleaning.
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BSC015NE2LS5IATMA1 Overview
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