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BSC016N06NSATMA1 - Infineon

Description: MOSFET N-Ch 60V 100A DSON-8 OptiMOS

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PCB Footprints
BSC016N06NSATMA1 - Infineon PCB footprint - Other - Other - PG-TDSON-8-17
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3D Models
BSC016N06NSATMA1 - Infineon  - 3D model - Other - PG-TDSON-8-17
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BSC016N06NSATMA1 Details

  • Manufacturer Part Number:

    BSC016N06NSATMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Country Of Origin:

    Austria, Germany, Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    380 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    30 A

  • Drain-source On Resistance-Max:

    0.0016 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    139 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC016N06NSATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BSC016N06NSATMA1 is -55°C to 175°C.
  • To ensure proper biasing, the gate-source voltage (Vgs) should be between 4.5V and 10V, and the drain-source voltage (Vds) should be within the specified range of 10V to 60V.
  • A good PCB layout should include a solid ground plane, short and wide traces for the drain and source pins, and a thermal pad for heat dissipation. Thermal management should include a heat sink or thermal interface material to keep the junction temperature below 175°C.
  • To protect the MOSFET from ESD, handle the device by the body or use an ESD wrist strap, and ensure the PCB has ESD protection circuits, such as TVS diodes or ESD protection arrays.
  • The maximum current rating for the BSC016N06NSATMA1 is 16A, but this can be derated based on the operating temperature and PCB thermal design.

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