Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal pad design, copper thickness, and via placement to ensure optimal thermal performance.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider using a heat sink or thermal management system.
Infineon recommends following the JEDEC standard J-STD-020D for soldering conditions, which specifies a peak temperature of 260°C and a dwell time of 30-60 seconds.
To prevent damage, store the devices in their original packaging, avoid exposure to moisture, and handle them by the body rather than the leads to prevent mechanical stress.
The BSC026NE2LS5ATMA1 has built-in ESD protection, but it's still essential to follow proper ESD handling procedures, such as using an ESD wrist strap or mat, to prevent damage during handling and assembly.
Trust Checks
This model has been verified by system checks.
System Verified
Sponsored
BSC026NE2LS5ATMA1 Overview
Use the download button to access the BSC026NE2LS5ATMA1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BSC02,
or try a keyword search, such as Power Field-Effect Transistors
Suggested Parts
If you searched for BSC026NE2LS5ATMA1, you might also be interested in these parts:
