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BSC032NE2LS - Infineon

Description: MOSFET N-Ch 25V 84A TDSON-8 OptiMOS

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BSC032NE2LS - Infineon PCB footprint - Other - Other - BSC032NE2LS-2
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BSC032NE2LS - Infineon  - 3D model - Other - BSC032NE2LS-2
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BSC032NE2LS Details

  • Manufacturer Part Number:

    BSC032NE2LS

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    20 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    22 A

  • Drain-source On Resistance-Max:

    0.0048 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    37 W

  • Pulsed Drain Current-Max (IDM):

    336 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC032NE2LS Frequently Asked Questions (FAQs)

  • Infineon recommends a PCB layout with a large copper area connected to the thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, including proper heat sinking, and to operate the device within the specified temperature range.
  • The BSC032NE2LS has built-in ESD protection, but it is still recommended to follow standard ESD handling precautions when handling the device to prevent damage.
  • The BSC032NE2LS is designed to operate in a normal humidity environment. For high-humidity environments, additional protection measures such as conformal coating or potting may be necessary to prevent moisture ingress.
  • The BSC032NE2LS should be stored in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 125°C.

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