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BSC034N06NSATMA1 - Infineon

Description: N-Channel 60 V 100A (Tc) 2.5W (Ta), 74W (Tc) Surface Mount PG-TDSON-8-7

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PCB Footprints
BSC034N06NSATMA1 - Infineon PCB footprint - Other - Other - BSC034N06NSATMA1-3
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BSC034N06NSATMA1 - Infineon  - 3D model - Other - BSC034N06NSATMA1-3
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BSC034N06NSATMA1 Details

  • Manufacturer Part Number:

    BSC034N06NSATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Germany, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    71 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    21 A

  • Drain-source On Resistance-Max:

    0.0034 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC034N06NSATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BSC034N06NSATMA1 is -55°C to 175°C.
  • To minimize power losses, ensure the MOSFET is driven with a high enough gate-source voltage (Vgs) to fully enhance the device. A Vgs of at least 10V is recommended.
  • The maximum current rating for the BSC034N06NSATMA1 is 34A.
  • Use a suitable overvoltage protection (OVP) circuit and overcurrent protection (OCP) circuit to prevent damage to the MOSFET. A fuse or a current-sensing resistor can be used for OCP.
  • Use a PCB layout that minimizes thermal resistance and ensures good heat dissipation. A thermal pad or heat sink can be used to improve thermal management.

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