Please enter a minimum 3 letters or numbers
Technical Content
Part Image

BSC050NE2LS - Infineon

Description: MOSFET N-Ch 25V 58A TDSON-8 OptiMOS

Download BSC050NE2LS Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
BSC050NE2LS - Infineon - PCB symbol
click to zoom
PCB Footprints
BSC050NE2LS - Infineon PCB footprint - Other - Other - BSC050NE2LS-2
click to zoom
3D Models
BSC050NE2LS - Infineon - 3D model - Other - BSC050NE2LS-2
click to zoom

BSC050NE2LS Details

  • Manufacturer Part Number:

    BSC050NE2LS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, PLASTIC, TDSON-8

  • Pin Count:

    8

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    10 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    60 A

  • Drain-source On Resistance-Max:

    0.0076 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    28 W

  • Pulsed Drain Current-Max (IDM):

    240 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC050NE2LS Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's current and voltage ratings at high temperatures.
  • The BSC050NE2LS has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. Use an ESD wrist strap or mat, and ensure the device is stored in an ESD-safe environment.
  • Yes, but ensure the device is properly sealed or coated to prevent moisture ingress. Follow the recommended storage and handling procedures to prevent moisture-related damage.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the power supply voltage, decoupling capacitors, and PCB layout for any issues. Consult the datasheet and application notes for troubleshooting guidelines.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BSC050NE2LS Overview

Use the download button to access the BSC050NE2LS schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BSC05, or try a keyword search, such as Power Field-Effect Transistors

Parts related to BSC050NE2LS

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑