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BSC050NE2LSATMA1 - Infineon

Description: MOSFET N-Ch 39A 25V OptiMOS TDSON8EP

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Symbol
BSC050NE2LSATMA1 - Infineon - PCB symbol
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PCB Footprints
BSC050NE2LSATMA1 - Infineon PCB footprint - Other - Other - PG-TDSON-8_1
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BSC050NE2LSATMA1 - Infineon - 3D model - Other - PG-TDSON-8_1
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BSC050NE2LSATMA1 Details

  • Manufacturer Part Number:

    BSC050NE2LSATMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, PLASTIC, TDSON-8

  • Pin Count:

    8

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    10 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    60 A

  • Drain-source On Resistance-Max:

    0.0076 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    240 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC050NE2LSATMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a PCB layout with a large copper area for heat dissipation, and a thermal via array under the device to improve thermal conductivity.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider using a thermocouple or thermistor to monitor the device temperature.
  • Infineon recommends a soldering temperature of 260°C (max) for 10 seconds (max) using a solder with a melting point above 217°C. Follow the IPC-J-STD-020 standard for reflow soldering.
  • Yes, but ensure proper mechanical fixation of the device and PCB to prevent damage. Also, consider using a vibration-resistant mounting method, such as a screw or clip, to secure the device.
  • Check the input voltage, output voltage, and current consumption. Verify that the device is properly connected and configured. Consult the datasheet and application notes for troubleshooting guidelines.

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BSC050NE2LSATMA1 Overview

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