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BSC0902NS - Infineon

Description: MOSFET N-Ch 30V 100A TDSON-8 OptiMOS

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Symbol
BSC0902NS - Infineon - PCB symbol
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PCB Footprints
BSC0902NS - Infineon PCB footprint - Other - Other - PG-TDSON-8_1
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3D Models
BSC0902NS - Infineon - 3D model - Other - PG-TDSON-8_1
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BSC0902NS Details

  • Manufacturer Part Number:

    BSC0902NS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    40 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    24 A

  • Drain-source On Resistance-Max:

    0.0035 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    48 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC0902NS Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Also, consider using a heat sink with a thermal resistance of less than 10 K/W.
  • The maximum allowed voltage on the enable pin (EN) is 6 V. Exceeding this voltage may damage the device.
  • Yes, but ensure that the device is properly heat-sunk and the PCB is designed to handle high currents. The device can handle high currents, but excessive heat generation can reduce its lifespan.
  • Use a logic analyzer or oscilloscope to monitor the input and output signals. Check for proper power supply voltage, enable signal, and input signal integrity. Verify that the device is properly heat-sunk and the PCB is designed according to the recommended layout guidelines.

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BSC0902NS Overview

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