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BSC146N10LS5ATMA1 - Infineon

Description: OptiMOSTM5Power-Transistor,100V

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BSC146N10LS5ATMA1 - Infineon - PCB symbol
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BSC146N10LS5ATMA1 - Infineon PCB footprint - Other - Other - BSC146N10LS5ATMA1-2
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BSC146N10LS5ATMA1 Details

  • Manufacturer Part Number:

    BSC146N10LS5ATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Germany, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    30 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    44 A

  • Drain-source On Resistance-Max:

    0.0146 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    15 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    2.5 W

  • Power Dissipation-Max (Abs):

    52 W

  • Pulsed Drain Current-Max (IDM):

    176 A

  • Reference Standard:

    IEC-68-1; IEC-61249-2-21

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC146N10LS5ATMA1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the BSC146N10LS5ATMA1 is a TO-220 package with a minimum pad size of 6.5mm x 4.5mm and a thermal pad size of 3.5mm x 3.5mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
  • To ensure proper cooling, it's essential to provide a sufficient heat sink with a thermal resistance of less than 10°C/W. The heat sink should be mounted to the device using a thermal interface material (TIM) with a thermal resistance of less than 0.1°C-in²/W. Additionally, ensure good airflow around the heat sink to dissipate heat efficiently.
  • The maximum allowed voltage for the BSC146N10LS5ATMA1's gate-source voltage (VGS) is ±20V. Exceeding this voltage can damage the device. It's essential to ensure that the gate driver circuitry is designed to limit the VGS to within this range.
  • To protect the BSC146N10LS5ATMA1 from ESD, handle the device by the body or use an ESD wrist strap or mat. Ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays, to prevent ESD damage during assembly and operation.
  • The BSC146N10LS5ATMA1 is suitable for operating frequencies up to 100kHz. However, the device can be used at higher frequencies with proper design considerations, such as minimizing parasitic inductance and capacitance, and ensuring proper gate drive and layout.

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BSC146N10LS5ATMA1 Overview

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