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BSH111,215 - Nexperia

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BSH111,215 - Nexperia  - 3D model
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BSH111,215 Details

  • Manufacturer Part Number:

    BSH111,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-236

  • Package Description:

    PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    0

  • Additional Feature:

    FAST SWITCHING

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    55 V

  • Drain Current-Max (ID):

    0.335 A

  • Drain-source On Resistance-Max:

    4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    10 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSH111,215 Frequently Asked Questions (FAQs)

  • A good PCB layout for the BSH111,215 should include a solid ground plane, a thermal relief pattern under the device, and a minimal number of thermal vias to reduce thermal resistance. A 2-layer or 4-layer PCB is recommended.
  • To ensure reliable operation at high temperatures, ensure that the device is properly heatsinked, and the PCB is designed to minimize thermal resistance. Also, consider derating the device's power handling at high temperatures according to the datasheet.
  • The recommended soldering profile for the BSH111,215 is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. A reflow soldering process is recommended.
  • To protect the BSH111,215 from ESD, handle the device with an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors.
  • Store the BSH111,215 in a dry, cool place, away from direct sunlight and moisture. Handle the device with care, avoiding bending or flexing the leads. Use anti-static packaging and follow proper ESD precautions.

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BSH111,215 Overview

Use the download button to access the BSH111,215 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BSH11, or try a keyword search, such as Small Signal Field-Effect Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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Part Image BSH111BK Nexperia

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Part Image BSH111,235 NXP Semiconductors

Small Signal Field-Effect Transistor, 0.335A I(D), 55V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-236AB

Part Image 2N7002-T1-E3 Vishay Intertechnologies

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Part Image 2N7002E-T1-E3 Vishay Siliconix

TRANSISTOR 240 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236AB, ROHS COMPLIANT, TO-236, 3 PIN, FET General Purpose Small Signal

Part Image 2N7002E-T1-GE3 Vishay Siliconix

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For a full list of alternate parts for BSH111,215, check out Findchips.com