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BSH111BKR - Nexperia

Description: N-Channel 55 V 210mA (Ta) 302mW (Ta) Surface Mount TO-236AB

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Symbol
BSH111BKR - Nexperia - PCB symbol
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PCB Footprints
BSH111BKR - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23 (TO-236AB)
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3D Models
BSH111BKR - Nexperia - 3D model - SOT23 (3-Pin) - SOT23 (TO-236AB)
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BSH111BKR Details

  • Manufacturer Part Number:

    BSH111BKR

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    55 V

  • Drain Current-Max (ID):

    0.21 A

  • Drain-source On Resistance-Max:

    4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    7 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSH111BKR Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the BSH111BKR is a 0603 package with a land pattern of 0.8 mm x 0.8 mm. It's essential to follow the recommended footprint to ensure proper soldering and thermal performance.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the BSH111BKR on the pads. Use a reflow oven or a hot air gun to melt the solder paste, and ensure the component is properly aligned during the soldering process.
  • The BSH111BKR has an operating temperature range of -40°C to 150°C. However, it's essential to note that the device's performance may degrade at extreme temperatures, and it's recommended to operate the device within a temperature range of -20°C to 125°C for optimal performance.
  • To prevent damage, store the BSH111BKR in its original packaging or in a dry, cool place away from direct sunlight. Avoid exposing the device to moisture, extreme temperatures, or physical stress during shipping and storage.
  • The BSH111BKR has an ESD rating of 2 kV human body model (HBM) and 150 V machine model (MM). To prevent ESD damage, handle the device with ESD-protective equipment, such as wrist straps or mats, and ensure the workspace is ESD-safe.

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This model has been built in collaboration with the manufacturer.
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BSH111BKR Overview

Use the download button to access the BSH111BKR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BSH11, or try a keyword search, such as Small Signal Field-Effect Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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