Part Image

BSL307SPL6327HTSA1 - Infineon

Description: A

Download BSL307SPL6327HTSA1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
BSL307SPL6327HTSA1 - Infineon PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - PG-TSOP-6_1
click to zoom
3D Models
BSL307SPL6327HTSA1 - Infineon  - 3D model - SOT23 (6-Pin) - PG-TSOP-6_1
click to zoom

BSL307SPL6327HTSA1 Details

  • Manufacturer Part Number:

    BSL307SPL6327HTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP

  • Package Description:

    ROHS COMPLIANT, PLASTIC, TSOP-6

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE, AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    44 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    5.5 A

  • Drain-source On Resistance-Max:

    0.043 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    22 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Element Material:

    SILICON

BSL307SPL6327HTSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal pad design, copper thickness, and via placement to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow Infineon's guidelines for thermal management, including proper heat sink design, thermal interface material selection, and monitoring of junction temperature.
  • Infineon recommends following the soldering conditions outlined in their application note AN2013-02, which includes guidelines for reflow soldering, wave soldering, and hand soldering to ensure reliable assembly.
  • To troubleshoot issues with the overcurrent protection feature, check the device's datasheet for specific guidance on fault detection and fault handling. Additionally, verify that the device is properly configured and that the current sense resistor is correctly sized.
  • Operating the device at the maximum rated voltage may reduce its lifespan and increase the risk of premature failure. It's essential to follow Infineon's guidelines for voltage derating and to ensure that the device is operated within its recommended operating conditions.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BSL307SPL6327HTSA1 Overview

Use the download button to access the BSL307SPL6327HTSA1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BSL30, or try a keyword search, such as Power Field-Effect Transistors

Parts related to BSL307SPL6327HTSA1

Showing 0 results

BSL307SPL6327HTSA1 Alternates

Showing results

Image Part Number Model
Part Image BSL307SPH6327XTSA1 Infineon Technologies AG

Power Field-Effect Transistor, 5.5A I(D), 30V, 0.043ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET