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BSP125H6433XTMA1 - Infineon

Description: Infineon BSP125H6433XTMA1 N-channel MOSFET Transistor, 0.12 A, 600 V, 4-Pin SOT-223

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BSP125H6433XTMA1 - Infineon - PCB symbol
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PCB Footprints
BSP125H6433XTMA1 - Infineon PCB footprint - SOT223 (4-Pin) - SOT223 (4-Pin) - SOT-223-4
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3D Models
BSP125H6433XTMA1 - Infineon - 3D model - SOT223 (4-Pin) - SOT-223-4
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BSP125H6433XTMA1 Details

  • Manufacturer Part Number:

    BSP125H6433XTMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    0.12 A

  • Drain-source On Resistance-Max:

    45 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    0.48 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

BSP125H6433XTMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, such as heat sinks or fans, to maintain a safe operating temperature.
  • The BSP125H6433XTMA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the BSP125H6433XTMA1 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard and is suitable for use in harsh environments.
  • Infineon recommends soldering the device using a reflow soldering process with a peak temperature of 260°C for 20-30 seconds. Ensure that the soldering process is within the specified temperature range to prevent damage to the device.

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BSP125H6433XTMA1 Overview

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