Infineon recommends a thermal pad on the bottom side of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Infineon recommends using a thermal interface material (TIM) between the device and the heat sink, and ensuring good airflow around the device. Additionally, consider using a heat sink with a thermal resistance of ≤ 10°C/W.
Infineon recommends a peak reflow temperature of 260°C, with a soldering time of ≤ 60 seconds. The device is compatible with lead-free soldering processes.
Infineon recommends storing the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads.
Infineon recommends using an ESD protection device with a human body model (HBM) rating of ≥ 2 kV and a machine model (MM) rating of ≥ 200 V. Ensure that the ESD protection device is connected between the device pins and the PCB ground.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
BSP129H6327XTSA1 Overview
Use the download button to access the BSP129H6327XTSA1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BSP12,
or try a keyword search, such as Power Field-Effect Transistors
