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BSP31,115 - Nexperia

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BSP31,115 - Nexperia  - 3D model
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BSP31,115 Details

  • Manufacturer Part Number:

    BSP31,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-73

  • Package Description:

    PLASTIC, SC-73, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT223

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1997-09-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    0

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    1 A

  • Collector-Base Capacitance-Max:

    20 pF

  • Collector-Emitter Voltage-Max:

    60 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    50

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

  • Turn-off Time-Max (toff):

    650 ns

  • Turn-on Time-Max (ton):

    500 ns

  • VCEsat-Max:

    0.5 V

BSP31,115 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the BSP31,115 is a 1.6 mm x 0.8 mm pad with a 0.5 mm x 0.5 mm thermal pad in the center. This ensures optimal thermal performance and ease of assembly.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C. Apply a small amount of solder paste to the PCB pads and place the device. Use a reflow oven or a hot air gun to solder the device, following the recommended soldering profile.
  • The maximum allowed voltage on the input pins of the BSP31,115 is 5.5 V. Exceeding this voltage may damage the device.
  • To ensure ESD protection, handle the BSP31,115 by its body or pins, avoiding direct contact with the die. Use an anti-static wrist strap or mat, and store the device in an anti-static bag or container.
  • The thermal resistance (Rth(j-a)) of the BSP31,115 is 25 K/W. This value represents the thermal resistance from the junction to the ambient air.

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BSP31,115 Overview

Use the download button to access the BSP31,115 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BSP31, or try a keyword search, such as Power Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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