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BSP315P - Infineon

Description: SIPMOS Small-Signal-Transistor

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Symbol
BSP315P - Infineon - PCB symbol
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PCB Footprints
BSP315P - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - PG-SOT223-4_2024-1
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3D Models
BSP315P - Infineon - 3D model - SOT223 (3-Pin) - PG-SOT223-4_2024-1
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BSP315P Details

  • Manufacturer Part Number:

    BSP315P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5.22

  • Additional Feature:

    AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    24 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    1.17 A

  • Drain-source On Resistance-Max:

    0.8 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.8 W

  • Pulsed Drain Current-Max (IDM):

    4.68 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSP315P Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and component placement to minimize thermal resistance and ensure reliable operation.
  • The gate resistor value depends on the specific application, switching frequency, and gate drive voltage. As a general guideline, Infineon recommends a gate resistor value between 1 Ω and 10 Ω. For more specific guidance, refer to the application note AN2013-03 or consult with an Infineon FAE.
  • The maximum allowed voltage for the bootstrap capacitor is typically limited by the capacitor's rating, but Infineon recommends not exceeding 35 V to ensure reliable operation and prevent damage to the IC.
  • Infineon provides guidelines for EMI filtering and layout in the application note AN2013-03. Additionally, following the PCB layout recommendations and using a common-mode choke, as well as placing the IC close to the load, can help minimize EMI and ensure compliance with EMC standards.
  • The recommended operating temperature range for the BSP315P is -40°C to 150°C, but the device can operate up to 175°C for short periods. However, it's essential to ensure proper thermal management and follow the recommended PCB layout to prevent overheating.

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BSP315P Overview

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