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BSP320SH6327XTSA1 - Infineon

Description: MOSFET N-Ch 60V 2.9A SOT-223-3

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PCB Footprints
BSP320SH6327XTSA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - PG-SOT223-4
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3D Models
BSP320SH6327XTSA1 - Infineon  - 3D model - SOT223 (3-Pin) - PG-SOT223-4
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BSP320SH6327XTSA1 Details

  • Manufacturer Part Number:

    BSP320SH6327XTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    GREEN, PLASTIC PACKAGE-4

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    60 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    2.9 A

  • Drain-source On Resistance-Max:

    0.12 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.8 W

  • Pulsed Drain Current-Max (IDM):

    11.6 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Element Material:

    SILICON

BSP320SH6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
  • Follow the recommended operating temperature range (Tj) of -40°C to 150°C, and consider using thermal interface materials to reduce thermal resistance.
  • Use a shielded enclosure, ensure proper grounding, and follow Infineon's guidelines for PCB layout and component placement to minimize electromagnetic interference.
  • Implement external protection circuits, such as TVS diodes and current limiting resistors, to prevent damage from voltage and current surges.
  • Store the devices in their original packaging, avoid exposure to moisture and extreme temperatures, and handle the devices by the body or leads to prevent electrostatic discharge.

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BSP320SH6327XTSA1 Overview

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