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BSP324H6327XTSA1 - Infineon

Description: Infineon BSP324H6327XTSA1 N-channel MOSFET Transistor, 0.17 A, 400 V, 4-Pin SOT-223

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PCB Footprints
BSP324H6327XTSA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - PG-SOT223-4_2023
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3D Models
BSP324H6327XTSA1 - Infineon  - 3D model - SOT223 (3-Pin) - PG-SOT223-4_2023
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BSP324H6327XTSA1 Details

  • Manufacturer Part Number:

    BSP324H6327XTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223

  • Pin Count:

    4

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    400 V

  • Drain Current-Max (ID):

    0.17 A

  • Drain-source On Resistance-Max:

    25 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5.7 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.8 W

  • Pulsed Drain Current-Max (IDM):

    0.68 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    127 ns

  • Turn-on Time-Max (ton):

    13.5 ns

BSP324H6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance.
  • Infineon recommends following the guidelines in their application note AN2013-01 for thermal design and layout, and also ensuring that the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.
  • Infineon recommends following the soldering conditions specified in their application note AN2013-01, which includes guidelines for reflow soldering, wave soldering, and hand soldering.
  • Infineon recommends following the ESD protection guidelines in their application note AN2013-01, which includes guidelines for handling, storage, and assembly to prevent ESD damage.
  • Infineon recommends using decoupling capacitors with a value of 100nF to 1uF, with a voltage rating of 10V to 25V, and a ceramic or film capacitor type, placed as close as possible to the device's power pins.

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