Please enter a minimum 3 letters or numbers
Technical Content
Part Image

BSP52T1G - onsemi

Description: The SOT-223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die; Available in 12 mm Tape and Reel Use BSP52T1 to order the 7 inch/1000 unit reel Use BSP52T3 to order the 13 inch/4000 unit reel; PNP Complement is BSP62T1; Pb-Free Package is Available; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

Download BSP52T1G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
BSP52T1G - onsemi - PCB symbol
click to zoom
PCB Footprints
BSP52T1G - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT−223 (TO−261) CASE 318E−04 ISSUE R
click to zoom
3D Models
BSP52T1G - onsemi - 3D model - SOT223 (3-Pin) - SOT−223 (TO−261) CASE 318E−04 ISSUE R
click to zoom

BSP52T1G Details

  • Manufacturer Part Number:

    BSP52T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223 (TO-261) 4 LEAD

  • Pin Count:

    4

  • Manufacturer Package Code:

    0.0318

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Terminal Finish:

    MATTE TIN

  • Time@Peak Reflow Temperature-Max (s):

    30

BSP52T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package is recommended for optimal thermal performance. A copper pour on the PCB with multiple vias to a solid ground plane is also recommended to dissipate heat efficiently.
  • The device requires a stable voltage supply and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to provide a stable voltage and current to the device.
  • The device is sensitive to electrostatic discharge (ESD). Handling the device requires proper ESD protection, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging and storage.
  • Troubleshooting the device requires a systematic approach, including checking the power supply, biasing circuit, and signal integrity. A logic analyzer or oscilloscope can be used to debug the device's behavior.
  • The BSP52T1G meets the quality and reliability standards of the automotive industry, including AEC-Q101 and ISO/TS 16949. The device is also manufactured in accordance with onsemi's quality and reliability standards.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BSP52T1G Overview

Use the download button to access the BSP52T1G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BSP52, or try a keyword search, such as Power Bipolar Transistors

Suggested Parts

If you searched for BSP52T1G, you might also be interested in these parts:
Part Number
ZXMP6A13GTA
BAS21LT1G
SMAJ58CA
5084
BPV10NF
REF3020AIDBZT
ESP8266 ESP-07
2-5338556-1
744770127

Parts related to BSP52T1G

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑