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BSP613PH6327XTSA1 - Infineon

Description: MOSFET P-Channel 60V 2.9A SOT223-4

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PCB Footprints
BSP613PH6327XTSA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT 223
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3D Models
BSP613PH6327XTSA1 - Infineon  - 3D model - SOT223 (3-Pin) - SOT 223
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BSP613PH6327XTSA1 Details

  • Manufacturer Part Number:

    BSP613PH6327XTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    4

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    150 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    2.9 A

  • Drain-source On Resistance-Max:

    0.13 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    120 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    1.8 W

  • Power Dissipation-Max (Abs):

    1.8 W

  • Pulsed Drain Current-Max (IDM):

    11.6 A

  • Reference Standard:

    AEC-Q101; IEC-61249-2-21; IEC-68-1

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    71 ns

  • Turn-on Time-Max (ton):

    35 ns

BSP613PH6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal pad design, copper thickness, and via placement to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider using a heat sink or cooling system. Additionally, ensure that the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.
  • The BSP613PH6327XTSA1 has built-in ESD protection, but it's still essential to follow proper ESD handling and storage procedures to prevent damage. Infineon recommends using an ESD wrist strap or mat, and storing the devices in anti-static packaging.
  • Yes, the BSP613PH6327XTSA1 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard, and Infineon provides a PPAP (Production Part Approval Process) documentation package for automotive customers.
  • Infineon provides guidelines for soldering and rework in their application note AN2013-02, which includes recommended temperature profiles, soldering times, and rework procedures to ensure reliable assembly and minimize the risk of damage.

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