TRANSIENT; OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE
Interface IC Type:
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code:
R-PDSO-G8
JESD-609 Code:
e3
Length:
5 mm
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
8
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Output Current Flow Direction:
SINK
Output Peak Current Limit-Nom:
4 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1.75 mm
Supply Voltage-Max:
34 V
Supply Voltage-Min:
5 V
Supply Voltage-Nom:
13.5 V
Surface Mount:
YES
Technology:
MOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
40
Turn-off Time:
170 µs
Turn-on Time:
140 µs
Width:
4 mm
BSP742TXUMA1 Frequently Asked Questions (FAQs)
Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal pad design, copper fill, and via placement to ensure optimal thermal performance.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
When selecting a heat sink for the BSP742TXUMA1, critical parameters to consider include the thermal resistance (Rth), heat sink material, and surface finish. A heat sink with a low thermal resistance (e.g., < 5°C/W) and a surface finish that ensures good thermal contact (e.g., nickel plating) is recommended.
To protect the BSP742TXUMA1 from electrostatic discharge (ESD), follow proper handling and storage procedures, use ESD-protective packaging, and consider implementing ESD protection circuits in the system design.
Infineon recommends following the soldering conditions outlined in their application note AN2013-01, which includes guidelines for peak temperature, soldering time, and temperature ramp rates to ensure reliable solder joints.
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BSP742TXUMA1 Overview
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