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BSP75NHUMA1 - Infineon

Description: Infineon BSP75NHUMA1, 1-Channel Intelligent Power Switch, Low Side, 0.7A, 60V 3+Tab-Pin, SOT-223

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PCB Footprints
BSP75NHUMA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - BSP-75N
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3D Models
BSP75NHUMA1 - Infineon  - 3D model - SOT223 (3-Pin) - BSP-75N
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BSP75NHUMA1 Details

  • Manufacturer Part Number:

    BSP75NHUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-223

  • Package Description:

    SOT-223, 4 PIN

  • Pin Count:

    4

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOT-223

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.8 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    75 V

  • Supply Voltage1-Min:

    60 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.3 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    20 µs

  • Turn-on Time:

    20 µs

  • Width:

    3.5 mm

BSP75NHUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • The device requires a stable voltage supply and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to provide a stable voltage and current to the device.
  • For high-frequency operation, it's essential to minimize parasitic inductance and capacitance. Use a ground plane, keep signal traces short and wide, and avoid vias and right-angle bends in the signal path.
  • Use ESD protection devices such as TVS diodes or ESD arrays at the input and output pins. Ensure that the PCB design includes a clear path to ground for ESD discharge.
  • For high-power applications, ensure good thermal contact between the device and a heat sink. Use a thermal interface material (TIM) and a heat sink with a high thermal conductivity. Ensure good airflow around the heat sink.

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