Part Image

BSP762T - Infineon

Description: Power Switch ICs - Power Distribution SMART HIGH SIDE MINI-PROFET

Download BSP762T Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
BSP762T - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - P-DSO-8-6
click to zoom
3D Models
BSP762T - Infineon  - 3D model - Small Outline Packages - P-DSO-8-6
click to zoom

BSP762T Details

  • Manufacturer Part Number:

    BSP762T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    DSO-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    14

  • Additional Feature:

    ESD Value for IN pin is 1C

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    1.3 mA

  • Supply Voltage-Max (Vsup):

    34 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    13.5 V

  • Surface Mount:

    YES

  • Technology:

    SIPMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4 mm

BSP762T Frequently Asked Questions (FAQs)

  • Infineon recommends a 4-layer PCB with a solid ground plane, and to place the BSP762T close to the power source to minimize loop areas and reduce EMI.
  • Infineon recommends a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and to ensure a minimum of 10 mm² of copper area for heat dissipation.
  • The BSP762T can withstand voltage transients up to 40 V for a duration of 100 ms, but it's recommended to use a TVS diode or other protection circuitry to prevent damage from voltage spikes.
  • The BSP762T is rated for operation up to 150°C, but derating is required above 125°C. Consult the datasheet for specific derating curves and thermal management recommendations.
  • Infineon recommends using a logic analyzer or oscilloscope to monitor the input and output signals, and to check for proper power supply decoupling and thermal management.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BSP762T Overview

Use the download button to access the BSP762T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BSP76, or try a keyword search, such as Peripheral Drivers

Parts related to BSP762T

Showing 0 results