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BSP76E6433HUMA1 - Infineon

Description: Infineon BSP76E6433HUMA1, 1-Channel Intelligent Power Switch, Low Side, 1.4A, 0 → 10V 3 + Tab-Pin, SOT-223

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PCB Footprints
BSP76E6433HUMA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - PG-SOT223-4
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BSP76E6433HUMA1 - Infineon  - 3D model - SOT223 (3-Pin) - PG-SOT223-4
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BSP76E6433HUMA1 Details

  • Manufacturer Part Number:

    BSP76E6433HUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223

  • Package Description:

    GREEN, PLASTIC, SOT-223, 4 PIN

  • Pin Count:

    4

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.98

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    1.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.8 mm

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.3 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    100 µs

  • Turn-on Time:

    100 µs

  • Width:

    3.5 mm

BSP76E6433HUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to ensure good thermal conductivity. A minimum of 5 thermal vias with a diameter of 0.3 mm is recommended.
  • To ensure EMC, Infineon recommends using a shielded cable for the CAN bus, keeping the CAN bus wires away from noise sources, and using a common mode choke to filter out electromagnetic interference.
  • The recommended power-up sequence is to first apply the supply voltage (VCC) and then the battery voltage (VBAT). This ensures that the device powers up correctly and avoids any potential latch-up conditions.
  • To troubleshoot CAN bus issues, check the CAN bus termination resistors, ensure the CAN bus wires are properly connected, and use a CAN bus analyzer to monitor the bus activity and identify any errors.
  • The maximum allowed voltage on the I/O pins is VCC + 0.5 V, but not exceeding 7 V. Exceeding this voltage may damage the device.

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BSP76E6433HUMA1 Overview

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