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BSP772TXUMA1 - Infineon

Description: Power Switch ICs - Power Distribution Smart High Side MINI-PROFET

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BSP772TXUMA1 - Infineon  - 3D model
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BSP772TXUMA1 Details

  • Manufacturer Part Number:

    BSP772TXUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.98

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    17 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    34 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    230 µs

  • Turn-on Time:

    180 µs

  • Width:

    4 mm

BSP772TXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN191 'Power MOSFETs - Thermal Management' which includes guidelines for thermal vias, copper thickness, and heat sink design.
  • The BSP772TXUMA1 requires a gate-source voltage (Vgs) of 10V to ensure optimal switching performance. Additionally, a gate resistor (Rg) of 10-20 ohms is recommended to reduce ringing and oscillations.
  • Monitor the device's junction temperature (Tj), drain-source voltage (Vds), and drain current (Id) to prevent overheating. Ensure the device operates within the recommended operating conditions and thermal boundaries.
  • Yes, the BSP772TXUMA1 is suitable for high-frequency switching applications up to 1 MHz. However, ensure proper PCB layout, decoupling, and snubber circuits are implemented to minimize ringing and electromagnetic interference (EMI).
  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures. Implement ESD protection circuits, such as TVS diodes or ESD protection arrays, in the system design to prevent damage.

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BSP772TXUMA1 Overview

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