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BSP88H6327XTSA1 - Infineon

Description: MOSFET N-Ch 240V 350mA SOT-223-3

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PCB Footprints
BSP88H6327XTSA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - PG-SOT223
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3D Models
BSP88H6327XTSA1 - Infineon  - 3D model - SOT223 (3-Pin) - PG-SOT223
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BSP88H6327XTSA1 Details

  • Manufacturer Part Number:

    BSP88H6327XTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    4

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    240 V

  • Drain Current-Max (ID):

    0.35 A

  • Drain-source On Resistance-Max:

    6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    1.4 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Element Material:

    SILICON

BSP88H6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN2013-01, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • Infineon recommends using a gate driver with a peak current capability of at least 5A and a voltage rating of 15V to 20V. The driver should also have a low propagation delay and a high common-mode rejection ratio.
  • The maximum allowed overcurrent for the BSP88H6327XTSA1 is 10 times the nominal current (IC) for a maximum duration of 10ms. However, it's recommended to limit the overcurrent to 5 times IC to ensure reliable operation.
  • To ensure EMC, follow Infineon's guidelines for PCB layout, component selection, and shielding. Use a common-mode choke and a differential-mode filter to reduce electromagnetic interference (EMI).
  • For high-power applications, Infineon recommends using a heat sink with a thermal resistance of ≤ 1.5 K/W and a fan with a minimum airflow of 200 L/min. Ensure proper thermal interface material and mounting to minimize thermal resistance.

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BSP88H6327XTSA1 Overview

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