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BSP92PH6327XTSA1 - Infineon

Description: MOSFET P-Ch -250V -260mA SOT-223-4

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PCB Footprints
BSP92PH6327XTSA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT 223_2021
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3D Models
BSP92PH6327XTSA1 - Infineon  - 3D model - SOT223 (3-Pin) - SOT 223_2021
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BSP92PH6327XTSA1 Details

  • Manufacturer Part Number:

    BSP92PH6327XTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    4

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    250 V

  • Drain Current-Max (ID):

    0.26 A

  • Drain-source On Resistance-Max:

    12 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    1.8 W

  • Pulsed Drain Current-Max (IDM):

    1.04 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Element Material:

    SILICON

BSP92PH6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the package and heat sink, and follow Infineon's recommended thermal design guidelines.
  • The BSP92PH6327XTSA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling to prevent damage.
  • Yes, the BSP92PH6327XTSA1 is AEC-Q101 qualified and suitable for high-reliability and automotive applications, but ensure you follow Infineon's specific guidelines and testing requirements.
  • Consult Infineon's application notes and troubleshooting guides, and consider using their recommended evaluation boards and development tools to aid in debugging.

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BSP92PH6327XTSA1 Overview

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