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BSS192,135 - Nexperia

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BSS192,135 - Nexperia  - 3D model
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BSS192,135 Details

  • Manufacturer Part Number:

    BSS192,135

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOT-89

  • Package Description:

    SC-62, TO-243, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT89

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    3

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    240 V

  • Drain Current-Max (ID):

    0.2 A

  • Drain-source On Resistance-Max:

    12 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    15 pF

  • JEDEC-95 Code:

    TO-243AA

  • JESD-30 Code:

    R-PSSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSS192,135 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BSS192,135 is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • To ensure proper biasing, make sure to provide a stable voltage supply, keep the input voltage within the recommended range (VCC = 2.7 V to 5.5 V), and maintain a low impedance output load. Additionally, ensure the device is properly decoupled with capacitors to minimize noise and oscillations.
  • For optimal thermal management, use a multi-layer PCB with a solid ground plane, and place the device near a heat sink or a thermal pad. Ensure good thermal conductivity by using thermal vias and a sufficient copper area. Keep the device away from high-current paths and noisy signals to minimize electromagnetic interference (EMI).
  • To prevent electrostatic discharge (ESD) damage, handle the device by the body or use an anti-static wrist strap. Ensure the PCB is designed with ESD protection in mind, using components like TVS diodes or ESD protection arrays. Follow proper assembly and handling procedures to minimize the risk of ESD damage.
  • When using the BSS192,135 in a high-frequency application, consider the device's frequency response, parasitic capacitance, and inductance. Ensure the PCB layout is optimized for high-frequency operation, using techniques like impedance matching, shielding, and minimizing trace lengths. Additionally, consider using a device with a higher frequency rating or a dedicated high-frequency transistor.

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BSS192,135 Overview

Use the download button to access the BSS192,135 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BSS19, or try a keyword search, such as Small Signal Field-Effect Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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For a full list of alternate parts for BSS192,135, check out Findchips.com