BSS83P footprint, schematic symbol and 3D model by Infineon

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Datasheet Download Datasheet
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Part Number BSS83P
Manufacturer Infineon
Pin Count 3
Part Category MOSFET (P-Channel)
Package Category SOT23 (3-Pin)
Footprint Name SOT23 (3-Pin) - PG-SOT-23_1
Released Date Feb 6, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

BSS83P Details

Manufacturer Part Number:
BSS83P
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
SOT-23
Pin Count:
3
ECCN Code:
EAR99
Manufacturer:
Infineon Technologies AG
YTEOL:
6.5
Additional Feature:
AVALANCHE RATED, LOGIC LEVEL COMPATIBLE
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
60 V
Drain Current-Max (ID):
0.33 A
Drain-source On Resistance-Max:
2 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
9 pF
JESD-30 Code:
R-PDSO-G3
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
3
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
P-CHANNEL
Power Dissipation-Max (Abs):
0.36 W
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
40
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

BSS83P Frequently Asked Questions (FAQs)

The maximum operating temperature range for the BSS83P is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
To ensure proper biasing, make sure to provide a stable voltage supply within the recommended range (typically 2.5V to 5.5V), and ensure the input voltage is within the specified range for the specific application.
For optimal thermal management, use a PCB layout that allows for good heat dissipation, such as using thermal vias and a heat sink. Keep the device away from heat sources and ensure good airflow around the device.
To prevent ESD damage, handle the device by the body or pins, avoid touching the pins, and use an ESD wrist strap or mat when handling the device. Also, ensure the PCB design includes ESD protection components, such as TVS diodes or resistors.
Store the BSS83P in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the device to mechanical stress, and handle the device with care to prevent damage.

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BSS83P Overview

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