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BSZ0904NSI - Infineon

Description: MOSFET N-Ch 30V 40A TDSON-8 OptiMOS

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Symbol
BSZ0904NSI - Infineon - PCB symbol
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PCB Footprints
BSZ0904NSI - Infineon PCB footprint - Other - Other - PG-TSDSON-8-25
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3D Models
BSZ0904NSI - Infineon - 3D model - Other - PG-TSDSON-8-25
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BSZ0904NSI Details

  • Manufacturer Part Number:

    BSZ0904NSI

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    20 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    75 A

  • Drain-source On Resistance-Max:

    0.0057 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    64 pF

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    37 W

  • Pulsed Drain Current-Max (IDM):

    300 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSZ0904NSI Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • The device requires a stable voltage supply and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to provide a stable voltage and current to the device.
  • Monitor the junction temperature (Tj), case temperature (Tc), and power dissipation (PD) to prevent overheating. Ensure that the device is operated within the recommended temperature range and power dissipation limits.
  • Use ESD protection devices such as TVS diodes or ESD protection arrays at the input and output pins. Ensure that the PCB is designed with ESD protection in mind, and handle the device with ESD-safe materials and tools.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device with ESD-safe materials and tools, and avoid bending or flexing the leads.

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BSZ0904NSI Overview

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