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BSZ215CHXTMA1 - Infineon

Description: MOSFET N/P-CH 20V 8TSDSON

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Symbol
BSZ215CHXTMA1 - Infineon - PCB symbol
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PCB Footprints
BSZ215CHXTMA1 - Infineon PCB footprint - Other - Other - PG-TSDSON-8-31_2023
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3D Models
BSZ215CHXTMA1 - Infineon - 3D model - Other - PG-TSDSON-8-31_2023
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BSZ215CHXTMA1 Details

  • Manufacturer Part Number:

    BSZ215CHXTMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSDSON-8

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    11 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    5.1 A

  • Drain-source On Resistance-Max:

    0.055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

BSZ215CHXTMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Infineon recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, consider using a thermistor or thermocouple to monitor the device temperature.
  • The BSZ215CHXTMA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. Use an ESD wrist strap or mat, and ensure the PCB is properly grounded.
  • Yes, the BSZ215CHXTMA1 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions and design guidelines to ensure reliable operation.
  • Infineon recommends following the JEDEC J-STD-020 standard for soldering, with a peak temperature of 260°C and a dwell time of 30-45 seconds. Ensure the PCB is designed for reflow soldering.

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BSZ215CHXTMA1 Overview

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