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BTA16-800BW3G - onsemi

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BTA16-800BW3G - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB CASE221A-07
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BTA16-800BW3G - onsemi  - 3D model - Transistor Outline, Vertical - TO-220AB CASE221A-07
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BTA16-800BW3G Details

  • Manufacturer Part Number:

    BTA16-800BW3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    TO-220AB

  • Package Description:

    LEAD FREE, CASE 221A-07, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    221A-07

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    2000 V/us

  • DC Gate Trigger Current-Max:

    50 mA

  • DC Gate Trigger Voltage-Max:

    1.1 V

  • Holding Current-Max:

    60 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    2 mA

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    16 A

  • Repetitive Peak Off-state Voltage:

    800 V

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    SNUBBERLESS TRIAC

BTA16-800BW3G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat. The copper area should be at least 1 inch² (6.45 cm²) and connected to a ground plane to ensure good heat dissipation.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the thermal resistance (RθJA) of the device and the PCB, and ensure that the maximum power dissipation is not exceeded.
  • A gate drive circuit with a resistance of 10-20 ohms and a capacitance of 10-100 nF is recommended. The gate drive voltage should be between 10-15V to ensure reliable switching.
  • Use a voltage clamp or a transient voltage suppressor (TVS) to protect the device from overvoltage. Also, consider using a current sense resistor and a fuse to protect the device from overcurrent.
  • Store the device in a dry, cool place away from direct sunlight. Handle the device by the body, not the leads, to prevent damage. Use an anti-static wrist strap or mat when handling the device to prevent electrostatic discharge (ESD) damage.

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BTA16-800BW3G Overview

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