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BTB10-600CRG - STMicroelectronics

Description: TRIAC Standard 600 V 10 A Through Hole TO-220

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PCB Footprints
BTB10-600CRG - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB
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3D Models
BTB10-600CRG - STMicroelectronics  - 3D model - Transistor Outline, Vertical - TO-220AB
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BTB10-600CRG Details

  • Manufacturer Part Number:

    BTB10-600CRG

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220AB, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Case Connection:

    MAIN TERMINAL 2

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Commutation Voltage-Min:

    5 V/us

  • Critical Rate of Rise of Off-State Voltage-Min:

    200 V/us

  • DC Gate Trigger Current-Max:

    25 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    25 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    1 mA

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    10 A

  • Repetitive Peak Off-state Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    4 QUADRANT LOGIC LEVEL TRIAC

BTB10-600CRG Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for voltage and current, and to ensure proper heat sinking and thermal management. Additionally, consider using a thermistor or thermal sensor to monitor the device temperature and implement over-temperature protection if necessary.
  • STMicroelectronics recommends soldering the BTB10-600CRG using a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 30 seconds. The device should be soldered using a solder paste with a melting point of 217°C (423°F) or higher.
  • Yes, the BTB10-600CRG is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard for automotive-grade devices, and is suitable for use in harsh environments. However, it's essential to follow the recommended operating conditions and to perform thorough testing and validation to ensure the device meets the specific requirements of your application.
  • To protect the BTB10-600CRG from ESD, it's essential to follow proper handling and storage procedures. Use an ESD wrist strap or mat when handling the device, and store it in an ESD-protected package. Additionally, consider using ESD protection devices, such as TVS diodes, in your circuit design to protect the device from ESD events.

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BTB10-600CRG Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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