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BTB12-800BW3G - onsemi

Description: TRIAC, 12A 50MA 800V TO-220AB PKG

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Symbol
BTB12-800BW3G - onsemi - PCB symbol
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PCB Footprints
BTB12-800BW3G - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - 2N6394
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3D Models
BTB12-800BW3G - onsemi - 3D model - Transistor Outline, Vertical - 2N6394
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BTB12-800BW3G Details

  • Manufacturer Part Number:

    BTB12-800BW3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    TO-220AB

  • Package Description:

    LEAD FREE, CASE 221A-09, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    221A-07

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • Case Connection:

    MAIN TERMINAL 2

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    2000 V/us

  • DC Gate Trigger Current-Max:

    50 mA

  • DC Gate Trigger Voltage-Max:

    1.1 V

  • Holding Current-Max:

    50 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    12 A

  • Repetitive Peak Off-state Voltage:

    800 V

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    4 QUADRANT LOGIC LEVEL TRIAC

BTB12-800BW3G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device on a thick copper plane, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components. A 2-3 oz copper thickness is recommended. Refer to onsemi's application note AND8345/D for more details.
  • To ensure reliable operation in high-temperature environments, follow the recommended derating curves, ensure good thermal design, and consider using a heat sink. Also, ensure that the device is operated within the specified junction temperature (Tj) range of -40°C to 150°C.
  • The maximum allowed voltage transient on the input pins is ±500 V, with a duration of ≤100 ns. Exceeding this limit may damage the device. It's essential to ensure that the input voltage is within the specified range and that proper ESD protection is implemented.
  • Yes, the BTB12-800BW3G is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101 and is manufactured using onsemi's automotive-qualified process. However, it's essential to follow the recommended design and testing guidelines to ensure the device meets the specific application requirements.
  • During PCB assembly and testing, it's essential to avoid applying voltage to the device's input pins before the power supply is connected. This can cause the internal ESD protection diodes to become forward-biased, potentially leading to device damage. Follow proper assembly and testing procedures to avoid this issue.

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BTB12-800BW3G Overview

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