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BTF3035EJXUMA1 - Infineon

Description: Power Switch ICs - Power Distribution The BTF3035EJ is a 35 mO single channel Smart Low-Side Power Switch with in a PG-TDSO-8-31 package providing embedded protective functions. The power transistor is built by an N-channel vertical power MOSFET. The device is monolithically integrated.

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Symbol
BTF3035EJXUMA1 - Infineon - PCB symbol
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PCB Footprints
BTF3035EJXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TDSO-8-31
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3D Models
BTF3035EJXUMA1 - Infineon - 3D model - Small Outline Packages - PG-TDSO-8-31
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BTF3035EJXUMA1 Details

  • Manufacturer Part Number:

    BTF3035EJXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOP-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Additional Feature:

    CURRENT LIMIT:28A; THERMAL SHUTDOWN:200C

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSOP

  • Package Equivalence Code:

    TSOP8,.25,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.15 mm

  • Supply Current-Max (Isup):

    2.5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

BTF3035EJXUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C. Implement thermal management techniques such as heat sinks, thermal interfaces, and airflow to keep the device temperature within the specified range.
  • The BTF3035EJXUMA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.
  • Yes, the BTF3035EJXUMA1 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard for automotive applications and is suitable for use in safety-critical systems.
  • Use a combination of visual inspection, signal analysis, and debugging techniques to identify the root cause of the issue. Consult the datasheet and application notes for troubleshooting guidelines and contact Infineon's technical support if needed.

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BTF3035EJXUMA1 Overview

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