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BTF3050TEATMA1 - Infineon

Description: Power Switch/Driver 1:1 N-Channel 3A PG-TO252-5-11

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PCB Footprints
BTF3050TEATMA1 - Infineon PCB footprint - Other - Other - BTF3050TEATMA1-3
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BTF3050TEATMA1 - Infineon  - 3D model - Other - BTF3050TEATMA1-3
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BTF3050TEATMA1 Details

  • Manufacturer Part Number:

    BTF3050TEATMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-252, 5/4 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.98

  • Built-in Protections:

    OVER VOLTAGE; THERMAL; TRANSIENT

  • Driver Number of Bits:

    1

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-252

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.5 mm

  • Supply Current-Max:

    6 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.14 mm

  • Terminal Position:

    SINGLE

  • Turn-off Time:

    30 µs

  • Turn-on Time:

    15 µs

  • Width:

    6.22 mm

BTF3050TEATMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • The device requires a stable voltage supply and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to set the desired bias point.
  • Monitor the device temperature, current, and voltage to prevent overheating. The device temperature should be kept below the maximum rated temperature, and the current and voltage should be within the recommended operating ranges.
  • Use ESD protection devices such as TVS diodes or ESD arrays at the input and output pins to protect the device from electrostatic discharge. Handle the device with ESD-safe materials and follow proper ESD handling procedures.
  • Store the device in a dry, cool place away from direct sunlight. Handle the device with ESD-safe materials and follow proper ESD handling procedures. Avoid bending or flexing the leads, and use a vacuum pick-up tool to handle the device.

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BTF3050TEATMA1 Overview

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