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BTM7810K - Infineon

Description: Electronic Component

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BTM7810K - Infineon  - 3D model
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BTM7810K Details

  • Manufacturer Part Number:

    BTM7810K

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK

  • Package Description:

    GREEN, PLASTIC, TO263, 15 PIN

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Built-in Protections:

    OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    4

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PSSO-G15

  • JESD-609 Code:

    e3

  • Length:

    21.6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    15

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    42 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SMSIP15H,.6,55TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    4.4 mm

  • Supply Voltage-Max:

    42 V

  • Supply Voltage-Min:

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.4 mm

  • Terminal Position:

    SINGLE

  • Turn-off Time:

    250 µs

  • Turn-on Time:

    220 µs

  • Width:

    9.25 mm

BTM7810K Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a large copper area for heat dissipation is recommended. The device should be placed near a heat sink or a metal plate for optimal thermal performance.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and consider using a heat sink with a high thermal conductivity. Also, ensure that the device is operated within the recommended temperature range.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage to the device.
  • Consult the application note and reference design provided by Infineon. Optimize the device's configuration, such as the gate driver, dead time, and switching frequency, to achieve the best performance for your specific application.
  • Handle the device by the body, not the pins. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD). Avoid touching the device's pins or exposed internal components.

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BTM7810K Overview

Use the download button to access the BTM7810K 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BTM78, or try a keyword search, such as Peripheral Drivers

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