BTS3104SDL footprint, schematic symbol and 3D model by Infineon

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PCB Footprints

BTS3104SDL - Infineon PCB footprint - Other - Other - PG-TO252-3-11_2024

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Part Number BTS3104SDL
Manufacturer Infineon
Pin Count 3
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - PG-TO252-3-11_2024
Released Date Jan 27, 2017
Last Modified Date Jun 25, 2024 8:04 AM UTC
Pinout / Pin List Click Here (Member Only)

BTS3104SDL Details

Manufacturer Part Number:
BTS3104SDL
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
TO-252
Package Description:
GREEN, PLASTIC, TO-252, 3 PIN
Pin Count:
4
Country Of Origin:
Malaysia
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Manufacturer:
Infineon Technologies AG
YTEOL:
14
Built-in Protections:
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL
Driver Number of Bits:
1
Interface IC Type:
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Length:
6.5 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
2
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Output Current Flow Direction:
SINK
Output Peak Current Limit-Nom:
2.5 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
TO-252
Package Equivalence Code:
SMSIP3H,.38,90TB
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Qualification Status:
Not Qualified
Screening Level:
AEC-Q100
Seated Height-Max:
2.5 mm
Supply Voltage-Max:
36 V
Supply Voltage-Min:
8 V
Supply Voltage-Nom:
13.5 V
Surface Mount:
YES
Technology:
MOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
2.28 mm
Terminal Position:
SINGLE
Turn-off Time:
200 µs
Turn-on Time:
120 µs
Width:
6.22 mm

BTS3104SDL Frequently Asked Questions (FAQs)

Infineon recommends a PCB layout with a large copper area connected to the exposed pad (EP) of the device to dissipate heat efficiently. A minimum of 2 oz copper thickness and a thermal via array under the EP are recommended.
The BTS3104SDL requires a stable voltage supply (VCC) and a proper biasing of the input stage. Ensure that the input voltage (VIN) is within the recommended range (4.5V to 5.5V) and the bias resistors (RBIAS) are correctly sized to set the desired output current.
The maximum allowed power dissipation for the BTS3104SDL is 2.5W. Exceeding this limit can lead to device damage or reduced lifespan. Ensure that the device is properly heat-sinked and the thermal design is optimized to stay within the recommended power dissipation limits.
The BTS3104SDL is rated for operation up to 150°C (TJ). However, the device's performance and lifespan may be affected at high temperatures. Ensure that the device is properly heat-sinked and the thermal design is optimized to minimize thermal stress.
Handle the BTS3104SDL with ESD-protective equipment and follow proper ESD-handling procedures to prevent damage. Ensure that the PCB design includes ESD-protection components, such as TVS diodes or ESD-protection arrays, to protect the device from ESD events.

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BTS3104SDL Overview

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