Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm to 0.5 mm is recommended.
The BTS3104SDR requires a stable voltage supply of 5V ± 5% and a bias current of 10 mA to 20 mA. Ensure the voltage regulator is capable of providing a low noise and low ripple output.
Infineon recommends a heat sink with a thermal resistance of ≤ 10 K/W and a fan with an airflow of ≥ 100 LFM to maintain a junction temperature below 150°C.
Handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure all equipment and tools are grounded. Avoid touching the device pins or handling the device during assembly.
The maximum allowed power dissipation for the BTS3104SDR is 30 W. Ensure the device is operated within the recommended thermal and electrical specifications to prevent overheating and damage.
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BTS3104SDR Overview
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