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BTS500851TMBAKSA1 - Infineon

Description: Infineon BTS500851TMBAKSA1, Quad-Channel Intelligent Power Switch, High Side, 44A, 5 → 58V 7-Pin, TO-220

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PCB Footprints
BTS500851TMBAKSA1 - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - BTS500851TMBAKSA1
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3D Models
BTS500851TMBAKSA1 - Infineon  - 3D model - Transistor Outline, Vertical - BTS500851TMBAKSA1
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BTS500851TMBAKSA1 Details

  • Manufacturer Part Number:

    BTS500851TMBAKSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    GREEN, PLASTIC, TO-220, 7 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PZFM-T7

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    11.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    ZFM

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Supply Voltage-Max:

    58 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    24 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    ZIG-ZAG

  • Turn-off Time:

    400 µs

  • Turn-on Time:

    110 µs

BTS500851TMBAKSA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BTS500851TMBAKSA1 is -40°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended thermal design and layout guidelines, and to implement adequate cooling mechanisms to prevent overheating.
  • The recommended PCB layout and design considerations include using a multi-layer PCB, placing the device near the power source, and using thermal vias to dissipate heat.
  • To troubleshoot issues, check the device's thermal performance, verify the PCB layout and design, and ensure that the device is operated within the recommended specifications.
  • The recommended soldering and assembly guidelines include using a soldering iron with a temperature range of 220°C to 250°C, and following the recommended reflow soldering profile.

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