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BTS5016-1EKB - Infineon

Description: Power Switch ICs - Power Distribution PROFET

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BTS5016-1EKB - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-14-47 EP_2024
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BTS5016-1EKB - Infineon  - 3D model - Small Outline Packages - PG-DSO-14-47 EP_2024
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BTS5016-1EKB Details

  • Manufacturer Part Number:

    BTS5016-1EKB

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-14

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    9

  • Additional Feature:

    CURRENT LIMIT:80A; THERMAL SHUTDOWN:200C

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Supply Voltage-Nom (Vsup):

    13.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.5V

  • Width:

    3.9 mm

BTS5016-1EKB Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BTS5016-1EKB is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • Proper cooling is crucial for the BTS5016-1EKB. Ensure good thermal contact between the device and a heat sink or PCB. Use thermal interface materials like thermal paste or thermal tape to fill gaps. Also, consider airflow and convection to dissipate heat.
  • For optimal performance, follow these PCB layout guidelines: keep the device away from high-current paths, use a solid ground plane, and minimize track lengths and widths. Also, ensure good decoupling and use a low-ESR capacitor for the supply voltage.
  • To protect the BTS5016-1EKB from overvoltage and overcurrent, use external protection components like TVS diodes, zener diodes, or fuses. Also, consider implementing overcurrent protection using a dedicated IC or a microcontroller.
  • For reflow soldering, use a profile with a peak temperature of 260°C (max) and a dwell time of 20-30 seconds above 220°C. For wave soldering, use a temperature of 250°C (max) and a dwell time of 3-5 seconds.

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BTS5016-1EKB Overview

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