TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Interface IC Type:
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code:
R-PDSO-G12
JESD-609 Code:
e3
Length:
7.5 mm
Moisture Sensitivity Level:
3
Number of Functions:
2
Number of Terminals:
12
Output Current Flow Direction:
SINK
Output Peak Current Limit-Nom:
3.9 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
HSSOP
Package Equivalence Code:
SOP12,.4,40
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Screening Level:
AEC-Q100
Seated Height-Max:
2.6 mm
Supply Voltage-Max:
40 V
Supply Voltage-Min:
5.5 V
Supply Voltage-Nom:
12 V
Surface Mount:
YES
Technology:
MOS
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
1 mm
Terminal Position:
DUAL
Turn-off Time:
270 µs
Turn-on Time:
250 µs
Width:
6.4 mm
BTS5210L Frequently Asked Questions (FAQs)
Infineon recommends a PCB layout with a large copper area connected to the thermal pad of the BTS5210L to dissipate heat efficiently. A minimum of 2oz copper thickness and a thermal via array under the device are recommended.
The selection of external components depends on the specific application requirements. Infineon provides a component selection guide in the application note AN215, which helps to determine the optimal component values based on the desired output voltage, current, and switching frequency.
To minimize EMI, it is essential to use a proper PCB layout, decoupling capacitors, and EMI filters. Shielding the device and the surrounding components can also help reduce EMI emissions. Infineon provides guidelines for EMI reduction in the application note AN215.
Infineon provides a troubleshooting guide in the application note AN215, which helps to identify and resolve common issues with the BTS5210L. Additionally, the device's fault detection and protection features can be monitored through the fault flag output.
The BTS5210L has a maximum junction temperature of 150°C. To ensure reliable operation, it is essential to provide adequate heat sinking, use a thermally conductive PCB material, and avoid overheating the device. Infineon provides thermal management guidelines in the application note AN215.
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BTS5210L Overview
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