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BTS700121ESPXUMA2 - Infineon

Description: IC Relay, Solenoid Driver N-Channel High Side 31.3A PG-TSDSO-24-32,2.47 m?,3.3 mA,28 V, -40°C ~ 150°C (TJ)

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BTS700121ESPXUMA2 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TSDSO-24
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BTS700121ESPXUMA2 - Infineon  - 3D model - Small Outline Packages - PG-TSDSO-24
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BTS700121ESPXUMA2 Details

  • Manufacturer Part Number:

    BTS700121ESPXUMA2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSDSOP-24

  • Country Of Origin:

    Germany, Indonesia, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G24

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.15 mm

  • Supply Current-Max (Isup):

    3.3 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Supply Voltage-Nom (Vsup):

    13.5 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +22.5V

  • Width:

    3.9 mm

BTS700121ESPXUMA2 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for BTS700121ESPXUMA2 is -40°C to 150°C.
  • To ensure reliability, follow the recommended thermal design guidelines, use a suitable heat sink, and ensure proper PCB layout and thermal management.
  • The recommended PCB layout involves using a thermal pad, vias, and a heat sink to minimize thermal resistance. Refer to the Infineon application note AN2013-01 for detailed guidelines.
  • Yes, the BTS700121ESPXUMA2 is qualified for use in humid environments, but it's essential to follow the recommended moisture sensitivity level (MSL) handling and storage guidelines to prevent damage.
  • To troubleshoot issues, refer to the Infineon troubleshooting guide, AN2013-02, which provides step-by-step procedures for identifying and resolving common problems.

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BTS700121ESPXUMA2 Overview

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