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BTT60101ERAXUMA1 - Infineon

Description: Power Switch ICs - Power Distribution PROFET

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BTT60101ERAXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TDSO-14
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BTT60101ERAXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-TDSO-14
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BTT60101ERAXUMA1 Details

  • Manufacturer Part Number:

    BTT60101ERAXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-14

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Additional Feature:

    ADDITIONAL EXTENDED OPERATING VOLTAGE 5 TO 48 V

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    9 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.25 mm

  • Supply Current-Max:

    9 mA

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    28 V

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    150 µs

  • Turn-on Time:

    150 µs

  • Width:

    3.9 mm

BTT60101ERAXUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to ensure good thermal conductivity. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • To ensure EMC, Infineon recommends following the guidelines in the application note AN2013-01, which provides information on PCB layout, component placement, and shielding. Additionally, the device should be placed at least 10 mm away from any metal objects.
  • Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time above liquidus of 30-60 seconds, and a cooling rate of 3-5°C/s. The device should be soldered using a no-clean flux and a solder alloy with a melting point above 217°C.
  • The device should be stored in a dry, cool place away from direct sunlight. It should be handled with anti-static precautions, such as using an anti-static wrist strap or mat. The device should be shipped in its original packaging or equivalent to prevent mechanical stress and electrostatic discharge.
  • The recommended operating voltage range for the BTT60101ERAXUMA1 is 12 V to 24 V, with a maximum voltage of 27 V. Operating the device outside of this range may affect its performance and reliability.

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