BU-64840B3-E02 - Data Device Corporation

BU-64840B3-E02 Details

• Manufacturer Part Number:

  BU-64840B3-E02

• Pbfree Code:

  No

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Package Description:

  BGA-324

• Pin Count:

  324

• Country Of Origin:

  Taiwan, USA

• HTS Code:

  8542.31.00.30

• Manufacturer:

  Data Device Corporation

• YTEOL:

  6

• Additional Feature:

  ALSO OPERATES AT 5V SUPPLY

• Address Bus Width:

  16

• Boundary Scan:

  NO

• Clock Frequency-Max:

  20 MHz

• Communication Protocol:

  MIL STD 1553A; MIL STD 1553B; MCAIR; STANAG-3838

• Data Encoding/Decoding Method:

  BIPH-LEVEL(MANCHESTER)

• Data Transfer Rate-Max:

  0.125 MBps

• External Data Bus Width:

  16

• JESD-30 Code:

  S-PBGA-B324

• JESD-609 Code:

  e0

• Length:

  20.7 mm

• Low Power Mode:

  YES

• Number of Serial I/Os:

  2

• Number of Terminals:

  324

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA324,18X18,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Qualification Status:

  Not Qualified

• Screening Level:

  MIL-STD-883

• Seated Height-Max:

  3.05 mm

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  3 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN LEAD

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  20.7 mm

• uPs/uCs/Peripheral ICs Type:

  SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553