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BU-67301B0T0R-E02 - DDC

Description: Ultra-Small, Ultra-Low Power MIL-STD-1553 Single Package Solution

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PCB Footprints
BU-67301B0T0R-E02 - DDC PCB footprint - BGA - BGA - 324-Ball BGA_1
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3D Models
BU-67301B0T0R-E02 - DDC  - 3D model - BGA - 324-Ball BGA_1
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BU-67301B0T0R-E02 Details

  • Manufacturer Part Number:

    BU-67301B0T0R-E02

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    16 X 16 MM, 4.70 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, BGA-324

  • Pin Count:

    324

  • Country Of Origin:

    Taiwan, USA

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Data Device Corporation

  • YTEOL:

    7

  • Boundary Scan:

    YES

  • Bus Compatibility:

    PCI; USB

  • Clock Frequency-Max:

    40 MHz

  • Communication Protocol:

    MIL STD 1553A; MIL STD 1553B; MCAIR; STANAG-3838

  • Data Encoding/Decoding Method:

    BIPH-LEVEL(MANCHESTER)

  • Data Transfer Rate-Max:

    0.125 MBps

  • JESD-30 Code:

    S-PBGA-B324

  • Length:

    16 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    324

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Seated Height-Max:

    4.7 mm

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    16 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553

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BU-67301B0T0R-E02 Overview

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